3 results listed
Many researches have been conducted on Schottky barrier diodes (SBDs) to improve the quality of the metal-
semiconductor (MS) structure and to control the barrier height (BH) using an organic interface layer instead of the
commonly used SiO2 [1,2]. The integration of the organic polymer interface layer into the M/S interface converts the
structure into a metal polymer semiconductor (MPS) structure [3]. The reliability and performance of MPS type SBDs
are greatly influenced by the quality and thickness of the interface layer [4]. In this study, MPS type SBDs with having
thin (50 nm) and thicker (150 nm) organic interlayers were fabricated to uncover the effects of different charge surface
states and thicknesses of organic insulator layer (PVA) on the electrical characteristics of the SBDs. The energy
distribution profile of the surface states (Nss) of these diodes have been investigated by used of the high-low frequency
capacitance (CLF-CHF) method. The value of Nss for 50 nm interlayer is almost one order higher than the value of Nss for
150 nm interlayer. This indicates that the insulator layer at metal/semiconductor interface can passivate the surface states
effectively.
International Symposium on Light Alloys and Composite Materials
UHAKS
Serhat Orkun TAN
In this work, the temperature dependent mean density of interface states (Nss) and series resistance (Rs) profiles
of Au/PVA (Gr-doped)/n-GaAs structures were determined from the current-voltage-temperature (I-V-T) measurements.
The other main electrical parameters such as zero-bias barrier height (ΦBo), ideality factor (n) and reverse-saturation
current (Io) were also obtained as a function of temperature. Experimental results show that the values of ΦBo, n, Io, Rs
and Nss were strongly voltage and temperature dependent. The experimental data confirmed that the values of Nss, Rs and
interfacial polymer layer are important parameters that influence the main electrical characteristics of these structures [1-
3].
International Symposium on Light Alloys and Composite Materials
UHAKS
Habibe Uslu Tecimer
Serhat Orkun TAN
Hüseyin Tecimer
Genel olarak üç boyutlu (3D) yazdırma veya hızlı prototipleme olarak bilinen eklemeli imalat (AM),
1980'lerin sonlarından beri kullanılmaktadır. 3D yazdırma teknolojisindeki gelişmeler, 4D yazdırma
adı verilen yeni ve heyecan verici bir teknolojinin geliştirilmesine yol açmıştır. 4D yazdırma, dış
uyarıcılara yanıt veren önceden programlanmış “akıllı malzeme” kullanımı ile sağlanır. Bu, “4D
yazdırma” olarak bilinir ve dördüncü boyutta zamana atıfta bulunur. Akıllı malzemelerin piyasaya
sürülmesiyle, imal edilmiş bileşenler, uygulanan dış uyarıcılara bir cevap olarak zaman içerisinde
şeklini veya özelliklerini değiştirebilir. Bu çalışmada, ilk önce 3D ve 4D yazdırma hakkında genel
bilgi verilmiştir. Daha sonra 4D yazdırmadaki son teknolojik gelişmeler, yöntemler, akıllı malzemeler
ve bunların uygulamalarına odaklanarak özetlenmiştir. Sonuç olarak akıllı malzemelerin güncel
gelişmeleri ve uygulamaları ile 4D yazdırma teknolojisindeki kullanımı genel olarak ele alınmıştır. Additive manufacturing (AM), commonly known as three-dimensional (3D) printing or rapid
prototyping, has been introduced since the late 1980s. The developments of 3D printing technology
have led to the development of an exciting new technology called 4D printing. 4D printing enables
the use of ‘smart materials’ that can transform in a pre-programmed way in response to an external
stimuli. This is known as ‘4D printing’, with the fourth dimension referring to time. With the
introduction of smart materials, the AM- fabricated components are able to alter their shape or
properties over time as a response to the applied external stimuli. In this review, we first overview of
3D and 4D printing. We then summarize recent technological advances in 4D printing with focuses on
methods, smarts materials, and their applications. This paper overviews the current developments and
applications of smart materials and its use in 4D printing technology.
International Congress on 3D Printing (Additive Manufacturing) Technologies and Digital Industry
3D-PTC2019
Mehmet BOY
Halil DEMİR
Serhat Orkun TAN